5G_mmW 4-Channel Dual-Pol Phased-Array TRX IC [TRHJ-3140]
![5G_mmW 4-Channel Dual-Pol Phased-Array TRX IC [TRHJ-3140]](/uploadfile/2021/1228/20211228045057818.jpg)
Benefits:
The TRHJ-3140-F chip is a silicon based (CMOS) dual polarization integrated Tx and Rx 2-channel, 24.25 to 29.5GHz chip for phased array communication system.
The chip realizes Tx and Rx mode switching in half duplex mode. In the Tx mode, the two common port’s RF input signals are divided into two Tx channels respectively after power splitter. In the Rx mode, the received RF signal passes through two receiving channels and is simultaneously output by two common ports through the combiner. For the two above modes, the TRHJ-3140-F chip provides a 31 .5 dB gain adjustment range and a full 360°phase adjustment range with 6-bit resolution respectively in the radio frequency (RF) path (step: 0.5 dB and 5.625° respectively).
A simple 4-wire serial port interface (SPI) controls all registers. In addition, The special pin control can realize the fast
switching between receiving and transmitting modes, and ensure the synchronization of receiving and transmitting of all chips in the array system.
TRHJ-3140-F is packaged in WLCSP. The operating temperature range is -50℃ to +85℃
Introduction
MMIC is the core of AESA technology. XPHASED has a strong chip design team. These chips are customized for satellite communication application. The design has considered the convenience of use from the system level and fully embodied the optimal scheme for chips working with antenna. Cost has always been a major challenge to the popularization of AESA technology. Therefore, the design of XPHASED MMIC always focuses on low cost feature and for this purpose the low-cost manufacturing process is adopted, nevertheless XPHASED MMIC still reaches the world-class level in terms of the performance index. Moreover, These patented technologies of XPHASED enable us to quickly realize the chip update and improvement and be able to quickly respond to market changes at all times. These MMIC chips have both low power consumption and high performance features and can be used to develop sub-array panels in different configurations (e.g. 12 x12, 16x16, 32x32 subarrays etc.)
You may use it for car/train/yacht/vessel/caravan/oil & gas platform /aero/helicopter/UAV and other applications
